Solder Joint Reliability Prediction for Multiple Environments

Solder Joint Reliability Prediction for Multiple Environments

Andrew E. Perkins / Suresh K. Sitaraman

146,60 €
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Editorial:
Springer Nature B.V.
Año de edición:
2010
ISBN:
9781441946348
146,60 €
IVA incluido
Disponible
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Sobre IBD

Background.- Literature Review.- Unified Finite Element Modeling for Prediction of Solder Joint Fatigue.- Validation of Unified FEM for Thermal Cycling and Power.- Development of Fatigue Life Equations Under Low-Cycle Thermal and Power Cycling.- Validation of Unified FEM and Development of Fatigue-life Equations for Vibration.- Universal Predictive Fatigue Life Equation and the Effect of Design Parameters.- Acceleration Factor to Relate Thermal Cycles to Power Cycles for CBGA Packages.- Solder Joint Fatigue Failure under Sequential Thermal and Vibration Environments.- Solder Joint Reliability Assessment for Desktop and Space Applications.

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